Welcome!
The University of Maine CORE Micro/Nanofabrication Cleanroom (RRID:SCR_028249) is a 3500 ft2 class 1000 clean room that maintains dedicated instrumentation for micro- and nano-fabrication of microsensor technologies, and for atomic-scale materials synthesis research. This state-of-the-art nanotechnology facility was originally established under the Frontier Institute for Research in Sensor Technologies (FIRST) research center, and is located in the Engineering & Science Research Building.
Technical Services:
• Microlithography: Mask Aligners, Photoresist Spinners, Vapor Primer, Photoresist Asher, Laser Lithography and Machining System, Pattern Generator
• Thin Film Deposition: Electron Beam Evaporators, RF and Pulsed DC Sputter Deposition Systems, Plasma-Enhanced Chemical Vapor Deposition, Paralyne Coater, Atomic Layer Deposition
• Characterization: Surface Profilometer, Spectroscopic Ellipsometer;
• Dry Etch: Deep Reactive Ion Etching (DRIE), Reactive Ion Etching (RIE)
• Wet Etch: Spin/Rinse/Dry, RCA Clean, KOH Etch, Solvent Benches
• Thermal Processing: Four Stack Diffusion Furnaces, Rapid Thermal Annealing, Controlled Atmosphere Furnaces
Henry Carfagno
Operational Manager
207-581-3381
henry.carfagno@maine.edu
Michael Call
CORE Facilities Manager
207-581-3382
michael.call@maine.edu
Julie Rutherford
CORE Fiscal Officer
207-581-1118
julie.rutherford@maine.edu
Megan Tardif
Director of CORE
207-581-1225
megan.tardif@maine.edu
| Hours | Location |
|
Monday - Friday
|
Engineering & Science Research Building |
| Name | Role | Phone | Location | |
|---|---|---|---|---|
| Michael Call |
CORE Facilities Manager & Research Engineer
|
207-581-3382
|
michael.call@maine.edu
|
294 ESRB
|
| Henry Carfagno, PhD. |
Research Facilities Operational Specialist
|
207-581-3381
|
henry.carfagno@maine.edu
|
149 Barrows Hall / ESRB
|
| Julie Rutherford |
CORE Fiscal Officer
|
207-581-1118
|
julie.rutherford@maine.edu
|
|
| Megan Tardif |
CORE Director
|
207-581-1225
|
megan.tardif@maine.edu
|
| Service list |
| ► Cleanroom Use (2) | |||
| Name | Description | Price | |
|---|---|---|---|
| Cleanroom Daily Use |
Allows individuals to occupy space in the cleanroom for a full day when not using billable equipment. |
Internal
$12.00
each
Academic $16.00 each External $18.00 each |
|
| Cleanroom Entry Fee |
Charge for entry when not using equipment. Examples would be trainee entry or inviduals only using Cleanroom space only. |
Internal
$3.00
each
Academic $4.00 each External $4.50 each |
|
| ► Cleanroom Equipment (6) | |||
| Name | Description | Price | |
| Analysis / Characterization |
Thin film thickness and refractive index measurements Includes: Tencor Profilometer and J.A. Woolam Ellipsometer Billed per hour |
Inquire | |
| Deep Reactive Ion Etch (STS DRIE) |
Anisotropic etching for generating deep / high aspect ratio features Includes: STS DRIE Billed per hour |
Internal
$62.00
/hr
Academic $70.00 /hr External $80.00 /hr |
|
| Photolithography |
Pattern up to 100mm wafers with positive and negative photoresists for masked etch or lift-off. SU-8 negative acting high aspect ration epoxy resists for microstructures Includes: Karl Suss Aligner, Cobilt Aligner, Quintel Aligner, Headway Spinner, LASST Spinner, Solitek Vapor Primer, Photoresist Oven, Photolith Benches Billed per Hour |
Internal
$28.00
/hr
Academic $40.00 /hr External $50.00 /hr |
|
| Physical / Vacuum Deposition |
Sputter, E-Beam evaporation and Atomic layer deposition to coat substrates with pure and/or reacted (oxygen or nitrogen) metal thin films. Includes: LASST e-beam, Lesker Sputter, Temescal e-beam, AJA Sputter Billed per hour |
Internal
$45.00
/hr
Academic $50.00 /hr External $60.00 /hr |
|
| Plasma Etch / Chemical Vapor Deposition |
Plasma etching with O2 and CF4 process gases (Oxford RIE); silicon, silicon nitride and silicon dioxide isotropic etch (Oxford RIE); chemical vapor deposition of SiO2, Si3N4, SiOxNy, SiC and aSi (Oxford PECVD) and parylene (Specialty Coating Systems) Includes: Oxford RIE and Oxford PECVD Billed per hour |
Internal
$43.00
/hr
Academic $50.00 /hr External $60.00 /hr |
|
| Wet Processes |
Silicon wafer wet etch capabilities Includes: RCA bench, Pirahna/HF bench, KOH Bench, Solvent Bench, General Bench Billed per hour |
Internal
$15.00
/hr
Academic $22.00 /hr External $30.00 /hr |
|
| ► Non-Cleanroom Equipment (6) | |||
| Name | Description | Price | |
| XRD Reservation Hour |
Charge for first hour of XRD use. Includes 1st hour of XRD Hotstage use. |
Internal
$43.50
/hr
Academic $50.00 /hr External $50.00 /hr |
|
| XRD Secondary Machine Hours |
XRD Secondary Machine Hour to billed when the XRD Hot Stage is not in use. |
Internal
$10.50
/hr
Academic $12.50 /hr External $15.00 /hr |
|
| XRD Secondary Machine Hours: After Hours Usage |
Use when using the XRD M-F from 4:30-12:00am, 6:00-8:00am, weekends and holidays. Not available 12:00am - 6:00am |
Internal
$7.35
/hr
|
|
| XRD Hot Stage Secondary Hours |
Internal
$34.50
/hr
Academic $40.00 /hr External $40.00 /hr |
||
| XRD Hot Stage Secondary Hours: After Hours Usage |
Use when using the XRD Hot Stage M-F from 4:30pm -12:00am, 6:00-8:00am, weekends and holidays. Not available 12:00am - 6:00am |
Internal
$24.15
/hr
|
|
| MBraun MB200 MOD Glovebox Evaporator |
The MBraun MB200MOD glovebox and MiniVap thermal evaporator provide an inert environment free of moisture and oxygen for a variety of chemistry, physics, and chemical engineering applications, including:
|
Internal
$25.00
/hr
External $35.00 /hr Academic $30.00 /hr |
|
| ► Technical Assistance & Training (3) | |||
| Name | Description | Price | |
| Technical Training / Assistance: Carfagno |
Technical training and assistance from PhD level Research Scientist. Billed per Hour |
Internal
$45.00
/hr
Academic $75.00 /hr External $100.00 /hr |
|
| Student Lab Assistant |
Technical work or training provided by the Cleanroom Student Lab Assistant |
Internal
$17.00
/hr
External $25.00 /hr Academic $20.00 /hr |
|
| Technical Training / Assistance: Research Engineer Call |
Training and assistance from the Cleanroom Research Engineer. Technical work completed for a client. Packaging / Dicing Services: Full microdevice fabrication and packaging capabilities. Includes use of: Wire Bonders, Wafer Dicer, UV Laser Machining
|
Internal
$79.61
/hr
Academic $85.00 /hr External $100.00 /hr |
|
